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Chip, SMT & Material Technology Analysis (including Failure Analysis) 一. Core Featured Business of Chips: 1.Consulting services for chip design and development planning; 2.Chip packaging and testing; 3.Chip supplier management (including preliminary supplier selection, development, qualification, problem solving, auditing and capability improvement; already cooperating with a large enterprise group); 4.Chip problem solving and failure analysis (supported by professional chip experts). 5.Chip Failure Analysis: （1）Inspection, electrical testing, IV testing; failure investigation; development of failure analysis plans; non-destructive analysis; destructive analysis; （2）Non-destructive analysis: Functional and parameter testing, visual inspection, X-ray inspection and ultrasonic inspection; （3）Destructive analysis: Decapsulation, internal inspection, probe testing, failure location, chip delamination, micro-analysis, scanning electron microscopy inspection and EDX energy spectrum analysis, focused ion beam analysis; （4）Failure cause location, in-depth analysis, report summarization, improvement suggestions and measures, verification testing to ensure problems do not recur. 二. PCBA Failure Analysis: 1.Failure categories: electrical failure, mechanical failure, thermal failure, chemical failure, environmental failure; 2.Problem solving: inspection, electrical testing, failure analysis (scanning electron microscopy SEM, X-ray/CT inspection, thermal imaging inspection), composition analysis (energy dispersive X-ray spectroscopy EDS, Fourier transform infrared spectroscopy FTIR), environmental testing (temperature, temperature cycling), fault simulation and verification (circuit simulation, experimental verification); 3.Root cause analysis: based on the above data and results, combined with electronic component principles, comprehensively determine and analyze the root causes and provide solutions or suggestions. |