Education
Master of Science in Thin Film Materials, Soochow University
Professional Experience
1. Industry Experience
- 10 years of experience in product testing and failure analysis at backend packaging & testing facilities of leading foreign semiconductor companies.
- 10 years of experience in system-level failure analysis and material analysis for consumer electronic products.
2. Practical Experience
Proficient in semiconductor chip wafer manufacturing, packaging & testing processes, SMT processes, and reliability testing.
Expert in common failure modes, failure mechanisms, root cause analysis, and improvement recommendations for semiconductor packages and silicon wafers.
Specialize in system-level failure analysis of electronic products, including failure mode identification, fault localization, failure mechanism analysis, root cause analysis, and failure reproduction. Provide short-term corrective actions and long-term solution recommendations.
Possess rich hands-on experience in analyzing engineering samples, competitive product analysis, qualification tests, reliability tests, production line issues, quality monitoring, and customer returns. Skilled in solving complex technical problems encountered in production, R&D, or customer return scenarios.
Experienced in PCBA circuit analysis, mechanical analysis of electronic products, and appearance failure analysis, including discoloration, paint peeling, contamination, corrosion, warpage, cracking, scratches, coating delamination, abnormal noise, fracture, etc. Also proficient in chip mounting failures, FPC and connector failures, as well as various component functional failures.
Specialize in raw material analysis, including composition, structure and performance comparison analysis of metals (magnesium, aluminum, stainless steel), textiles, protective coatings, paints, dyes, adhesives, PSA, HAF, ACF, plastic components, brackets, screws, etc.
Familiar with magnesium/aluminum metal surface treatment, painting processes, PCB manufacturing, FPC/connector production, display panel processes and other component manufacturing technologies.
Proficient in the working principle, production process, main failure types, failure mechanisms and root cause analysis of lithium-ion batteries, with extensive experience in analyzing customer complaint samples involving thermal runaway.